Used EVG / EV GROUP 805EZD #9225230 for sale

EVG / EV GROUP 805EZD is an electronically controlled vacuum and atmospheric pressure wafer bonder specifically designed for microelectronic device manufacturing applications. This bonder is a reliable and easy to use equipment equipped with advanced control algorithms for precise and repeatable results. EVG 805EZD is a fully automated system with a small footprint, making it suitable for many types of laboratory and production facilities. It features a 12" (300 mm) wafer stage that accommodates a wide variety of wafer sizes and thicknesses. The unit's heating stage is powered by a custom designed resistive heating element that can process up to 5kW of total heat for application of an adhesive or solder paste bond. Furthermore, the heating element and bond areas are completely user configurable to facilitate different bond shapes and sizes. The unit also comes with multiple gas box configurations allowing it to be used with a variety of carrier gases such as nitrogen, argon, or helium. EV GROUP 805 EZD offers excellent flow control of the gases via an integrated stepper motor, allowing users to adjust the flow rate as needed for any given application. Additionally, the unit's onboard pressure monitor can be used to ensure optimal temperature and pressure conditions for a given bond application. For thermocompression bonding applications, 805 EZD utilizes a clamping force of up to 150N, with compensation forces and limiters to ensure even mechanical compression across the bond and to meet the requirements of specific wafer types. The unit's built-in programmable logic controller (PLC) also allows for automated temperature and force ramping as well as temperature or force settling, providing exceptional repeatability and reproducibility. To ensure safe operation of EVG / EV GROUP 805 EZD, the machine is equipped with an interlocking cover and door safety tool. This feature includes the use of safety limit switches and optically monitored wiring loops that prevent access to the bond area and protect the asset during operation. Overall, EV GROUP 805EZD is a highly precise and dependable automated bonder, ideal for microelectronic device manufacturing. It comes with a wide range of features, providing maximum control and flexibility for any type of bond application.