Used EVG / EV GROUP 820 #9197313 for sale

EVG / EV GROUP 820 is a top of the line die bonder from the renowned EVG. This automated die bonder is a precision tool designed to perform microelectronic assembly processes such as die and device attachment and encapsulation. EVG 820 specializes in working with light, thin and ultra-thin die with easy-to-use user interfaces. It is equipped with a reliable 4-point force monitoring equipment and fine tuning with high precision (down to 0.1 µm) in x-y-z axes. The system is integrated with several advanced features such as an advanced quality control routine with vision based automatic alignment as well as repeatability 3 Sigma accuracy. EV GROUP 820 can bond die and devices with different materials including Gold, Silver, Aluminum, Lead, Copper and Platinum. It features a precision aligning unit with ultra-fine needle accuracy of 1 to 5 µm in all three axes. The machine is designed with a 200 kHz automatic loop tuning and distortion correction. This ensures accurate placement of with the utmost efficiency. The bonder offers an adjustable thermal head with two temperature profiles and an adjustable heating element. The machine comes with a fully digital user interface, which includes 80 pre-configured modifiable process programs and quick set-up recipes. It is also equipped with an intuitive user navigation tool and, designed with detailed on-screen instructions. It also features an array of visual feedback tools, including instant process verification and in-depth bond diagnostics. 820 is an ideal solution for die bonding, wire bonding, device encapsulation, and active device flip-chip bonding processes. It can handle differences in substrate materials, with an adjustable angle, temperature/pressure control, and micro levelling procedure. Its compatibility with a range of materials and its power-saving capabilities make it an excellent choice for die bonding applications.