Used EVG / EV GROUP 820 #9206005 for sale

EVG / EV GROUP 820 is a fully-automated, contact and non-contact semiconductor bonder that is designed to boost passthrough efficiency and production yields in the semiconductor industry. The equipment is driven by a robotic arm with five axes that provides fast, repeatable, and accurate motion control. It is equipped with two tool holders that can guide wafers, substrates or flip chip parts through the process, as well as offer an automated cleaning and bonding process. At the heart of EVG 820 is the bonding head. This is the main unit responsible for the bonding process, which is performed by thermosonic gold bonding, wedge bonding or die bumping. It comes with a servo-controlled z-axis with a precision of 25um, a heated stage and an amplifier, as well as an automatic tool calibration system that ensures accuracy in all of its steps. The machine is capable of looping and skipping processes when required, and can achieve a repeatability of less than 3um. The unit is built with a modular design, allowing for users to configure it to suit their needs. It can be equipped with various types of gauge, ranging from a vision inspection machine, laser sensors, and air pressure sensors. It also includes a five-inch color touch screen with embedded automation software to provide a user-friendly and intuitive user interface. Finally, EV GROUP 820 is designed to work with a variety of materials, including a variety of bondwire and interconnects, with a range of workpiece sizes up to 50mmx50mm. It is built to handle high volumes of production and has a wafer-level bonding capacity of up to 8,000 pieces an hour, making it one of the fastest bonders available in the market.