Used EVG / EV GROUP 820 #9384485 for sale
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ID: 9384485
Wafer Size: 8"
Vintage: 2010
Mold carrier lamination system, 8"
2010 vintage.
EVG / EV GROUP 820 is a state-of-the-art wafer bonder developed by EVG. This bonder is designed for the highest throughput and production volumes, offering unparalleled accuracy and precision in the process. With its excellent process capabilities, EVG 820 can bond most types of materials of various sizes and shapes with precision and accuracy. The equipment is built on the concept of modularity, helping it achieve a more efficient production environment. This bonder can be used for rapid prototyping and general production needs in interconnect and 3D assembly applications, while also offering fast turnaround for various product development needs. It is capable of bonding materials such as glass, silicon, metal, plastics, and ceramics. The bonder can be used for processes such as die-attach, flip chip assembly, gold wire bonding, as well as other related processes. The bonder features an advanced work handling system which enables seamless processes by providing utmost accuracy and precision. Different carriers can be used within a single frame to provide the optimum configuration depending on the application. The intuitive user interface and advanced auto-centering capability makes it easy for the operator to set up the bonding process, while the integrated motion control reduces cycle times. EV GROUP 820 also features a range of built-in diagnostics and metrics which provides full traceability and scalability to the recording and recoding of quality data. This helps in ensuring maximum flexibility and productivity, allowing for higher overall yields in the production processes. The bonder also has a process adaptive temperature control unit which enables it to rapidly adapt to changing manufacturing conditions. It also boasts a maintenance-free lubrication machine which minimizes downtime and maximizes the bonder's uptime. With its modular design and advanced process elements, 820 is an ideal tool for production and research needs, enabling industry-leading productivity and yields. It is a reliable tool built to meet the needs of today's production environment, providing users with maximum throughput and proven technology.
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