Used EVG / EV GROUP 850 #293671690 for sale

EVG / EV GROUP 850
Manufacturer
EVG / EV GROUP
Model
850
ID: 293671690
Wafer bonder.
EVG / EV GROUP 850 is a precision and high speed bonder designed for a variety of bond joining techniques. This bonder is capable of joining materials made of different materials, such as metals, plastics or ceramics, in a wide range of metal-to-metal or metal-to-plastic assemblies. The high-end bonder features a precise process control system coupled with advanced motion technology. EVG 850 bonder has a number of different features to ensure efficient and accurate bonding processes. First, it is equipped with a Force Mode that allows for manual manipulation over the bond force applied during the bonding process. This allows the user to adjust the force profile, enabling optimal performance regardless of the bonding material. In addition, EV GROUP 850 offers an Auto-Force Bonding technique. This is a built-in function that automatically adjusts bond force based on the materials being joined. By allowing for adjustment of the bond force, this feature ensures that any unnecessary strain is eliminated, resulting in a high quality bond. The bonder also includes Precise Motion Control technology that ensures the most uniform and tight bondpositions on the part. This technology allows for multiple positioning, fine turns, automatic selection of the preheating zones, and high-resolution surface imagery to guarantee a precise and durable bond. Finally, 850 includes an intuitive graphical user interface, which provides a user-friendly environment and a convenient way of controlling the bonder. The user-friendly interface allows for debugging of the process parameters, simple handling of the bonder settings, and a wide range of reporting options. Overall, EVG / EV GROUP 850 is a reliable and precise bonder ideal for joining materials of different materials. With its wide range of features, the bonder allows users to achieve the highest level of quality and accuracy for their bonding processes.
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