Used EVG / EV GROUP 850 #293739578 for sale

EVG / EV GROUP 850 is a fully automated, die and wafer bonding equipment designed to enable efficient and precise assembly of materials. Featuring auto-focusing and auto-alignment capabilities, this system utilizes pneumatic and piezoelectric actuator technology to form strong adhesive bonds between components. The unit is capable of bonding even the smallest components with accuracy and repeatability, making it ideal for applications such as die-attach and opto-electronics. EVG 850 is driven by a user-friendly Windows-based graphical user interface (GUI). The machine features automated wafer handling, vacuum chucking, die delivery, sub-pixel monitoring, and automatic vision-guided alignment. After operator setup, the tool performs material validation, adjustment, and manual override to guarantee accurate and repeatable results. The bonding process is initiated by cleaning the substrate and start guide using a spin-rinse-dryer process prior to wafer loading. The asset then calibrates the alignment tool and begins the die attach process. The model can apply force as well as temperature and time when necessary to achieve the desired bond. Once the desired bond strength has been achieved, the equipment releases the bonded parts and then advances to the next cycle. Any flawed die is monitored and identified, facilitating defective die replacement with minimal rework time. EV GROUP 850 supports various bonding techniques, including thermal compression, ultrasonic, thermo-compression, gluing, and Eutectic die bonding. The system includes an array of accessories, such as a variety of wafer sizing plates, a wafer flipper for reversing wafers, and a bulk die outer cassette, allowing maximum flexibility in unit operation. Additional flexible process integration capabilities such as laser scribing are possible with 850, allowing adaptation to a variety of application needs. The machine is intended for use in a cleanroom environment, ensuring compliance with strict electrostatic discharge safety regulations. For comprehensive process control, the tool offers a range of data analysis features and process control capabilities, giving users the ability to monitor and maintain optimal process performance over time. Using the comprehensive data-logging feature, users can maintain a detailed log of the assembler's performance for future optimization. This makes EVG / EV GROUP 850 an ideal choice for light assembly applications, providing high levels of precision, reliability, and repeatability.