Used EVG / EV GROUP 850 #293804879 for sale

EVG / EV GROUP 850 is a cutting-edge, automated wafer bonder for the specialist packaging market. This equipment is capable of handling a variety of different sizes and types of components, from small die to large, curved substrates, all under a single software interface. The bonder is precision-engineered for quick, accurate alignment and accurate, repeatable results. It features two top-mounted modules for aligners and bonding plates. Each of these modules is driven by a controlled vacuum and driven to achieve accurate alignments. The bonder is further equipped with a high-resolution camera for vision-based wafer alignment and for inspection. The vision system optimizes for both the alignment accuracy as well as the overall wafer quality. This is aided by advanced optical features such as detection of epoxy molding compound and alloy-fill gaps. The bonder also features two DC servomotors which ensure the desired parameters for exact and reliable bonding are met. With the aid of this technology, the bonder is capable of efficiency, rendering the best possible results. The bonder is integrated with a controller that processes all parameters data relayed by the aligners and bonding arms. This ensures the correct pressure, temperature, and time are maintained during the bonding process. The bonder is compliant with SEMI/SECS standards, has fast wafer transition times, and has replaceable components, simplifying maintenance. It also offers password protection of recipes, ensuring that parameters are only changed by personnel who are authorized and certified. EVG 850 bonder offers a range of benefits due to its user-friendly design and advanced features. It is an effective and affordable solution for all types of packaging needs and ensures optimal results. Furthermore, its reliable and efficient performance ensure that the best possible results are rendered.