Used EVG / EV GROUP 850 #9233485 for sale

EVG / EV GROUP 850 is a bonder equipment that is used to automate and optimize MEMS manufacturing processes. It is a fully automated, easy to use manufacturing system that enables manufacturers to quickly and efficiently bond semiconductor dies onto leadframes, MEMS components onto leadframes or package, and wire bond devices. The unit offers a wide range of bonding techniques such as eutectic, wedge, stud, and solder and electron beam. The machine is designed for highest productivity and accuracy and is suitable for all types of process requirements from fine line bonding to die attach and package build. EVG 850 bonder has a small footprint and features an integrated XYZ manual column movement mechanism, thermal bonding stations, and a selection of optional RF-electrical bonding systems. It is capable of bonding arrays of up to 30,000 dies with high quality and accuracy standards. The tool has a high flexibility due to its open architecture block design and its unlimited program memory. The asset also offers advanced process control with flexible data management and monitoring, adjustable process repeatability, adjustable process parameter optimization, and a complete model level remote monitoring equipment. It also features an integrated safety system that includes process safety guards, emergency stop activation and other protective measures. EV GROUP 850 bonder is ideal for bonding all types of leadframes, cellphones, and MEMS components. It is an efficient, easy to use, automated manufacturing unit which is designed to reduce cost and improve product quality and reliability. It is ideal for high productivity and accuracy in manufacturing processes and will continue to be a great solution for bonding applications.