Used EVG / EV GROUP 850 #9272593 for sale

EVG / EV GROUP 850
Manufacturer
EVG / EV GROUP
Model
850
ID: 9272593
Wafer bonder With controller stand Pump (2) Totes.
EVG / EV GROUP 850 is an advanced bonding equipment designed to enable robust processes for customers in the microelectronics, optoelectronics, and life science industries. It is used for creating permanent bonds between materials using various techniques such as anodic bonding, eutectic bonding, and many other advanced bonding processes. EVG 850 features an intuitive touchscreen user interface, a wide variety of bonding tools, and the ability to integrate with automation systems. This enables users to quickly and easily set up and run automated bonding processes with various materials such as metals, glass, semiconductors, and ceramics. The advanced bonding technology used by EV GROUP 850 is designed to produce consistent and reliable results at high throughput rates and low defect densities. The system has a variety of heating and cooling capabilities, as well as advanced active alignment technology to ensure precise tolerances and physical performance. 850 includes a wide range of options to cater for many specific applications. It can be equipped with an integrated tension-compression force unit, 3D contour mapping, temperature mapping, and a patented pre-cleaning machine. This makes it possible for users to bond a variety of materials with ease and accuracy. EVG / EV GROUP 850 also offers a high level of safety. It features numerous safety mechanisms such as air pressure and temperature monitoring, a PVC coating, and an advanced emergency stop tool. Furthermore, the vacuum-sealed environment and integrated operator protection equipment ensure that the asset is always safe and the process is free of contamination. EVG 850 is designed to meet the highest quality standards and provide excellent results for almost any bonding application. It is an ideal choice for high throughput operations and is ideal for industries such as microelectronics, optoelectronics, automotive, aerospace, and medical device manufacturing.
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