Used EVG / EV GROUP 850 #9274204 for sale

EVG / EV GROUP 850 from EVG is a high-performance precision bonding machine. It offers robust throughput, accuracy and versatility for a wide range of bonding applications. The machine is designed to meet the tightest bond alignment specifications for advanced device packaging and flip-chip processes. The integrated modular design integrates various component types, control systems and software with improved accuracy, available over several bonder generations. EVG 850 full-field alignment equipment is driven by high quality imaging capabilities. This includes a StereoVision™-2K analyzer, integrated ThermalCycler™ thermal control system, and proprietary EV GROUP SmartScan™ multi-pass software. A selectable driver set optimizes performance in all applications. The machine also has pulse power modules designed specifically for tight alignment applications, such as those required for direct bonding and high-volume production. EV GROUP 850 is designed to provide a fast, automated bonding process with precision alignment, while also assuring great stability. The machine features the Piezo Flexure Alignment Stage, EVG / EV GROUP Dedicated Drive Unit (EDDS), and high resolution measurement machine (HRMS). With the Piezo Flexure Alignment Stage, the user can analyze various parameters such as the bond mark locations, offsets, and deformations during operation. The EDDS tool ensures the bonder's precise handling capabilities and allows the user to control the bonder's movement in a variety of parameters such as acceleration, velocity, and position. The HRMS asset combines thermally stabilized optics, photodetector electronics, advanced image processing algorithms, and a second-generation brightness stabilization model. This ensures that the bonder is capable of making precise bonds with high repeatability and improved yields. 850 also offers a highly developed process monitoring equipment utilizing high-sensitivity pressure sensors and custom-made third-generation binder programming. EVG / EV GROUP 850 is ideal for reliable, high-Volume production requirements for advanced semiconductor packaging, MEMS, and flip-chip processing. The advanced imaging, high precision, repeatability, and the modular design ensure that the machine is ready for any challenge. Its precision and capabilities make it a powerful choice for even the most advanced bonding processes.