Used EVG / EV GROUP 850DB #293652096 for sale

EVG / EV GROUP 850DB production bonder is an automated general purpose production bonder designed for the purposes of active optical component assembly, ceramic package bonding and photosensitive die attach applications. This bonder is an ideal tool for large-scale semiconductor production and optical communications subsystems, as it provides extreme accuracy and high throughput. EVG 850DB production bonder complies with all industry standards for precision and performance. This bonder has the ability to process multiple die sizes with a range from 0.25mm X 0.25mm up to 4mm X 4mm. Also, it is capable of bonding 0.2 mm pitch wire bonds with accuracy up to 10 microns. The design of the bonder includes an environmental chamber which allows for the quality and consistency of the bond processes. This chamber is temperature controlled, capable of maintaining a temperature up to 150°C. Moreover, the temperature is also monitored to ensure a uniform bond process. EV GROUP 850DB production bonder is equipped with a flexible and modular bond head design which can be used for multiple bond types and production needs. This bonder uses the EnvironFlex range of electric, pneumatic and heating components. This helps to enable consistent quality and productivity across a wide range of materials and applications. Due to the microprocessor-controlled software and hardware, 850DB production bonder is extremely precise and fast. There is a seven inch touchscreen, which allows to easily set up and control the bonding process. It is designed to achieve greater accuracy, production volume, and repeatability than traditional methods. EVG / EV GROUP 850DB adopts modern technology and advanced features such as automated die positioner, die poke travel control, force-time monitoring, automatic die pivot compensation, and pressure sensor. This enables the user to optimize the bond processing time. EVG 850DB production bonder is a cost-effective solution, allowing users to achieve extreme reliability, accuracy and efficiency in their production processes. It is a precise, fast, and reliable solution, especially suitable for advanced microelectronics fabrication and assembly.