Used EVG / EV GROUP 850DB #293729337 for sale

EVG / EV GROUP 850DB is an automated die bonder for a wide range of high-precision die attach, wirebond and epoxy dispensing processes used in the production of microelectronic components. It utilizes a state of the art machine vision equipment to recognize the die and terminal locations, and provides an optimized placement as well as high-precision die/terminal registration. EVG 850DB is controlled by closed-loop servo motors, meaning its movements are continuously monitored and adjusted to ensure high accuracy and repeatability. Additionally, the system offers programmable accuracy, so users can adjust to their precision requirements. The unit's die attach head can work at up to 20g acceleration. This allows for significant cycle time reduction and high-speed production. EV GROUP 850DB can bond a variety of die sizes ranging from 1.5mm x 1.5mm to 10mm x 10mm. Also, this machine can make use of both low-temp and high-temp eutectic as well as non-eutectic die attachments. To facilitate this, the tool is equipped with programmable temperature control for curing the adhesive. In addition, it uses a precision, non-contact die temperature measurement asset to control this process. 850DB also has a 4-axis wire bonder to provide wire wiring capabilities. It supports a total of 12 bonding materials and works with a wide variety of wire sizes ranging from 0.25mm to 0.7mm in diameter. To ensure accurate wire placement, the model's movement engine has a resolution down to 0.03mm. Similarly, the equipment's epoxy dispenser uses a programmable dispensing head and can accurately dispense volumes down to 0.2nL. The system is equipped with the intuitive ASPEN software and offers a wide range of fault detection and prevention features, such as die open/short noise testing, eye pattern continuity testing, and SMDIRTE testing. The unit also features data logging capabilities and quality traceability, allowing users to monitor process parameters and product information to aid in troubleshooting, failure analysis and process quality improvement. Overall, EVG / EV GROUP 850DB provides high-precision and high-speed die attach, wire bond and epoxy dispensing capabilities, making it an ideal choice for production of high-reliability microelectronic components.