Used EVG / EV GROUP 850DB #293762490 for sale

EVG / EV GROUP 850DB is a high performance automated bonder and point-to-point die bonder equipment. It offers superior 3-D bonding accuracy and precision assembly with advanced robotic automation, while delivering high throughput and manufacturing flexibility. EVG 850DB system is comprised of a four-axis motion platform integrated with a die bonder, a beam unit and an integrated vision machine. The four-axis motion platform is capable of both two- and three-dimensional bonding, allowing for accurate placement of dies and interconnects over a wide range of distances and angles. The beam tool allows for precise die placement on the bonder stage, while the integrated vision asset compensates for any errors in the initial die position or alignment. EV GROUP 850DB's individual product capabilities include ball bonding, wedge bonding and stitch bonding. The model supports all common ball bonds, ranging from 0.3mm to 4.4mm in size for bonding gold or aluminum wires. It also supports high-precision wedge bonding for direct gold wire, die looping, and wedge-bonded resistor configurations. 850DB's stitch-bonding capabilities are also impressive, providing tighter-toleranced stitch spacing and superior stitch bond looping, enabling the conditioning of soft gold wire at lower energy settings. Because of its reliable robotic automation and precision assembly, EVG / EV GROUP 850DB is an ideal solution for medical instrumentation, optoelectronics, and microelectronic assemblies. Its single point-to-point die bonding power makes it easy to switch between various die bonding processes, allowing for great flexibility in a production environment. In addition, EVG 850DB's beam equipment and vision enable efficient operation and quality control. EV GROUP 850DB is an exceptionally reliable, high performance bonder and die-bond system. Its precision assembly and robust automation capabilities enable customers to achieve high accuracy and throughput while enjoying maximum manufacturing flexibility.