Used EVG / EV GROUP 850DB #293810309 for sale

EVG / EV GROUP 850DB is a thermo-compression based bonder that is used for multiple microelectromechanical systems (MEMS) and semiconductor devices. It has been designed with an intuitive user interface and robust automation capabilities to suit a variety of applications. EVG 850DB bonder features a passively heated chuck with up to 15 discreet heating zones. This chuck allows for an even temperature distribution across all points of the work-piece, ensuring a consistent bond with minimal thermal excursion. This bonder is equipped with a long-life, durable lamination press and an enclosed pressure slab along with an in-feed mechanism to automatically disarm and index plastic carriers prior to bonding. The lamination pressure is adjustable up to 500psi for optimal process control, and can also be set to pulsed cycles for multiple bond stages and processes. EV GROUP 850DB bonder has an integrated vision system featuring a 5.6 MPixel Sony global shutter camera which allows for high speed personalised bond verification and automation. There are 5 LED light manifolds with individually adjustable light sources for optimal through-put. 850DB bonder has advanced process control capabilities including preHeat, ramp rates, peak temperature and time intervals to ensure reliable process repeatability. With a temperature range of -25 to +250 °C, it can accommodate a wide variety of materials for process optimisation. EVG / EV GROUP 850DB bonder also has a full suite of process and statistical control monitoring capabilities. Additionally, the Node-JS software platform (SxSLT) enables remote control of the bonding process and offers an intuitive open-architecture process design capability. In conclusion, EVG 850DB bonder is a high-performance and reliable device suitable for a wide variety of microelectronics applications. It is easy to use, offering precise and repeatable results. Additionally, the open-architecture platform makes it appealing to users who wish to further customise and automate their bonding process.