Used EVG / EV GROUP 850LT #293724861 for sale

Manufacturer
EVG / EV GROUP
Model
850LT
ID: 293724861
Wafer Size: 6"
Vintage: 2020
Wafer bonder, 6" Cleaning station Plasma chamber Bond chamber with vacuum Aligner: Flat to flat KAWASAKI NT521 Robot Plasma-activated bonding Vacuum: <0.00075 (torr) (2) Cleaning modules (2) Low temperature plasma activations Temperature range: 20-28°C 2020 vintage.
EVG / EV GROUP 850LT is an advanced, modular-design automated bonding equipment designed to handle a wide variety of applications for all types of substrates. It is a cost-effective, highly advanced automated bonding system that can deliver superior results with its high accuracy and repeatability. This unit is based on a proprietary motor-drive platform and elliptical-feedback motion-control machine. The tool utilizes two Elliptical Voice Coil Actuators to accurately position and direct the substrate in both x and y directions. EVG 850LT also uses an ultra-precise linear motor to apply precise force to the bonding surface of the substrate, thus providing an extremely accurate bond diameter. EV GROUP 850LT offers a wide range of bonding parameters to suit the application. The asset is capable of providing repeatable bond diameters as small as 0.1um, and can process multiple substrates simultaneously. In addition, it is capable of performing a wide range of bonder parameters, ranging from wire-bond pull-test to full temperature tuning. 850LT is also capable of handling thick substrates as well as thin substrates. Its advanced multi-axis robotic model is designed to process both thin and thick substrates at high speeds while still maintaining high accuracy and repeatability. The equipment also features an advanced vision system to detect and correct any misalignment or other irregularities related to the substrate position. In addition, the unit incorporates the latest technological advancements to allow for remote communication and process control. Its intuitive user interface allows users to easily configure the machine settings to meet their bonding requirements. This tool is extremely reliable and easy to maintain, ensuring optimal performance. Overall, EVG / EV GROUP 850LT automated bonding asset offers superior performance and accuracy at an outstanding price. With its advanced motion controls, advanced robotic technology, and intuitive user interface, this model is an ideal choice for those looking for an automated bonding equipment that can perform at high levels with minimal maintenance.
There are no reviews yet