Used EVG / EV GROUP 850TB #293762492 for sale

EVG / EV GROUP 850TB is an advanced die bonder and bonding equipment, designed for production in the semiconductor industry. The system is capable of precisely bonding a range of device classes, from passive components such as connectors to active components like lasers. The unit uses proprietary and patented die-based bonding technology to automate the bonding process. Bonding force is delivered with precision, and highly repeatable accuracy can be achieved. The proprietary bonding process allows for high throughput and cost efficiency in production. The machine features a high-efficiency dual-beam, robotic, and ergonomic design for maximum accuracy and high levels of production throughput. The high-force beam delivery feature allows a higher level of bonding effectiveness than traditional techniques, while achieving high performance at low levels of stress. The die positioning is precise and repeatable and allows for accurate and precise alignment of the bond elements. The tool also features an advanced combination of Thermal Compression Bonds in both flip-chips and wire bonds utilizing a heated die-frame. In addition, the asset offers the Freedom series of Bonders, which are designed to deliver accurate temperature control and repeatable thermo-mechanical bonding processes. The Freedom modules are equipped with high-efficiency thermal control systems to allow for consistently accurate bonding with precise temperature control. EVG also includes a full range of bonding accessories such as uprights, die-holders, dicing blades, die-positioners, and operators consoles. Bonding is further made easier with advanced software functions, such as automatic alignment and bond transfer. The software also allows for remote monitoring and control of the bonding production, with high levels of production performance data downloadable from the model. EVG 850TB is designed to provide the highest levels of precision, repeatability, and accuracy. It is a reliable, economical, and automated bonding equipment suitable for a variety of production scenarios. Furthermore, the system brings a high degree of confidence to users, providing consistent and reliable bonding results.