Used EVG / EV GROUP 850TB #293764363 for sale

EVG / EV GROUP 850TB is a fully-automated thermosonic wedge wire bonder. It is designed for applications requiring ultra precision flip chip and micro device bonding. EVG 850TB is capable of aligning and bonding wire bonds with superior force and speed. It features a patented three-axis alignment system that is capable of accurately setting and maintaining the bond gap of the electrodes. With its automatic alignment and bond gap control, EV GROUP 850TB ensures reliable and high-yield bonding of complex flip chip packages. The bonder's modular construction makes it highly customizable to user applications, as well as allowing for easy upgrade and maintenance. Its built-in, user-preprogrammable parameters control all aspects of the bonding process. 850TB also provides high throughputs for production and laboratory environments, employing a top-down, two-camera vision system for optimal accuracy of chip placement, bond gap, and wedge deposition. EVG / EV GROUP 850TB has an integrated computer with a touch-screen user interface, making it easy to set up and control all of the bonder's settings. The user can easily operate the bonder with the help of its user-friendly graphical user interface. EVG 850TB has a unique 'access window' that allows the user to access the bonding area with no disruption to the operating process. This feature makes it easy to adjust the bond gap and make other minor adjustments during production. Furthermore, EV GROUP 850TB has a user adjustable pre-programmable fluxing module. The user can customize the fluxing time and temperature settings to ensure optimum underfill activity and minimal waste. Additionally, 850TB comes with an error verification function that ensures all wire bonds are correct before their final inspection. EVG / EV GROUP 850TB also has a variety of safety features, such as a safety mesh to keep personnel away from dangerous areas of the bonder and safety covers to protect sensitive components and wires. In conclusion, EVG 850TB is a versatile, high-precision, and ultra-efficient bonder. Its advanced three-axis alignment system provides superior alignment and contact forces, and its user-friendly interface and pre-programmable settings make it easy to operate. Its integrated safety features, reliable performance, and high throughputs make it ideal for flip chip and micro device bonding applications.