Used EVG / EV GROUP AB1-PV #9036012 for sale
URL successfully copied!
Tap to zoom
ID: 9036012
Wafer Size: 2"-5"
Benchtop anodic bonder, 2"-5"
Accessories:
Balzers TPH 062 turbo pump
Balzers TCP015 turbo pump controller
Leybold Combivac CM31 gauge controller
Heater: 130mm diameter
Power requirements: 220 V, 1 phase, 50 Hz.
EVG / EV GROUP AB1-PV is a fully automated die bonding machine, designed and manufactured by EVG (EV GROUP). EVG AB1-PV is the latest platform in EVG / EV GROUP advanced "MoBond" series of die bonding systems, offering unparalleled precision, flexibility and reliability. With an intuitive visual interface and a wide range of features and accessories, EV GROUP AB1-PV is ideal for both new users and experienced die bonders. AB1-PV uses a state-of-the-art motion equipment, capable of bonding die with up to 10nm of positional accuracy. The machine also features a built-in vision system, ensuring reproducibility and extremely tight registration accuracy on all die attach operations performed. Additionally, EVG / EV GROUP AB1-PV offers adjustable axes for x-y-z motion for various substrate sizes and configurations, making it suitable for both thick and thin die attach applications. The machine also features a die bonder platform with a large heated aluminum platen to provide an even and stable heating surface. EVG AB1-PV is able to perform a wide range of die bonding processes, including Eutectic, Ribbon and Thermocompression die attach, as well as Leadframe Bumping, Ballbonging, Column Attach and Wirebonding. Additionally, the platform is equipped with a user-friendly graphical interface, allowing users to quickly and easily input process parameters and start bond processes quickly. EV GROUP AB1-PV also offers a comprehensive range of accessories, such as a bondhead calibration station, die load unit, die cycle station and electronic vision machine. Furthermore, EVG unique Hotloop bond control tool allows users to automatically adjust the process parameters and ensures repeatable results during automatic part-to-part bonding. Overall, AB1-PV is an advanced and reliable die bonder for demanding die attach applications. With a motion asset offering unparalleled accuracy, a wide range of features and accessories, a user-friendly graphical interface and the Hotloop bond control model for repeatable results, EVG / EV GROUP AB1-PV is the ideal die bonder for both new and experienced users.
There are no reviews yet