Used EVG / EV GROUP EV 500 #9183578 for sale

EVG / EV GROUP EV 500 is an automated bonder designed to provide reliable and precise electrical and thermocompression bonding of high-quality dies. It is a step-by-step fully automated equipment, which is able to integrate all necessary tasks for bonding and offers the latest technology to enable the highest quality and performance. The system is equipped with a built in vision to guide the user through a step-by-step bonding process, removing the need for manual input. It also includes a number of advanced features to ensure accurate results. The entire unit is enclosed in a temperature and humidity controlled environment and is capable of operating at temperature up to 200°C and down to -25°C. The bonder is able to form multiple bond parameters with its high precision machine, providing designs for optimal bonding with all types of chip dies and other surface mount components. It has a dual-evaporation feature which enables the easy adjustment of parameters for device distribution, fine-tuning of the distribution and the removal of all voids. The bonder also has an Optical Warpage compensation feature to ensure accurate and perfect bonding. The bonder is powered by a state-of-the-art industrial control tool and advanced software that gives users access to all necessary data and provides a traceable log for every bond. The software also provides the ability to analyze and monitor multiple components, as well as modify parameters on-the-fly for optimum process control. EVG EV 500 is a cost-effective and robust machine for mass production of high-quality dies and electrical and thermocompression bonding. With its advanced features and precise controls, it is an ideal asset for high-speed, low-cost production.