Used EVG / EV GROUP EV 560 #9239813 for sale

EVG / EV GROUP EV 560 is a fully-automated wafer bonding equipment used in the production of microelectronic devices. It provides a single integrated solution for all bonding applications, such as ultra-fine pitch, fine-pitch, high-density, and high-reliability. The system offers a range of processes including thermosonic, thermode, and eutectic bonds. The unit includes an integrated wafer monitoring and metrology machine to provide feedback during bonding operations. EVG EV 560 is designed with a multi-stage processing chamber and up to three robotic handlers for the loading and alignment of substrates. The chamber utilizes a high performance plasma source for etch processes and a UV laser for cutting and ablation. Additionally, the tool contains a wafer scanning asset for precise error-correction and optimized production process control. It supports a wide range of temperature control options to ensure that all bonding operations meet the highest standards of quality and throughput. The model also supports a graph-based software environment, providing tools for programing, application development and statistical process control. Additionally, it offers comprehensive data logging, analysis and reporting functions. The equipment is configured for easy scalability, enabling the customer to scale their production to changing process requirements and manufacturing conditions. EVG/EV Groups EV GROUP EV 560 is capable of processing substrates up to 300mm in diameter, making it suitable for all major wafer sizes. It is also compatible with a range of wafer materials, such as silicon, gallium arsenide, indium phosphide, and sapphire. The system features an advanced heated support unit for the increased bonding accuracy and yields. It also offers an optional heated shoulder machine which combines with rotational motorized stages for improved cycle times, accuracy and repeatability. EV 560 provides reliable and repeatable operation in a variety of wafer bonding applications, making it an ideal choice for production and research environments. Its modular design and flexible platform ensures compatibility with existing and future production needs, making it an excellent solution for semiconductor manufacturers working at the cutting edge.