Used EVG / EV GROUP EV 560 #9243153 for sale

EVG / EV GROUP EV 560 is a high performance die bonder engineered for the most demanding production and research and development applications. EVG EV 560 is designed for the needs of advanced semiconductor packaging, LED manufacturing, and microsystems. With its advanced vision equipment, users have the capability to create precision die bonding and reconfiguration alignment with pin-point accuracy. EV GROUP EV 560 features a fully automated loading and unloading system with a die picker, die rotation, die alignment, die verification and die placement, as well as an automatic device probing service. The die placement accuracy of EV 560 is 0.5 µm with a die rotation and tilt of +/- 1°, while its die picker accuracy is 20 µm in the XY plane, and 10 µm in the Z plane. Its integrated vision unit enables high speed and precise die bond recognition, as well as feedback on bond performance and micro adjustments for each bond as well as the overall process. EVG / EV GROUP EV 560 is further capable of up to four reconfiguration alignments per bond on a range of up to 20 µm, as well as optimized bond placement and pad pre-selection. Its auto search feature may analyze the entire lead frame for leads with 0.5 µm accuracy, and it allows for the placement of multiple dies in a single bonding cycle. EVG EV 560 includes a wide selection of machine configurations, such as different bonding heads, thermal compression bonding, dispensing, ultrasonic bonding, Wax and Isotropic options, Piezoelectric dispensers, advanced thermal controllers, force monitoring, hot in-die bonding, and a range of options for under-fill and over-fill. EV GROUP EV 560 is designed for optimal use with EVG proprietary EVG561 die bonding control and management software. EV GROUP bonders are well known for their reliability and robust performance, with a consistent accuracy and repeatability. EV 560 adds to this heritage with its advanced platform and integrated vision tool, as well as its capability for precise die-to-lead frame placement and reconfiguration alignment. EVG / EV GROUP EV 560 provides a reliable, robust, and accurate bonder that is engineered for advanced semiconductor packaging, LED manufacturing, and microsystems, as well as researchers and developers.