Used EVG / EV GROUP Gemini #293590399 for sale

EVG / EV GROUP Gemini
Manufacturer
EVG / EV GROUP
Model
Gemini
ID: 293590399
Automated wafer bonding system.
EVG / EV GROUP Gemini is an advanced, semi-automated, stand-alone flip-chip die bonder. It has been designed to handle large and small substrate sizes and feature set, die sizes and package heights. EVG Gemini is built on the modular bonder platform to offer unbeatable versatility, high degree of flexibility, and superior performance for bonders of its class. EV GROUP Gemini has a compact design, making it ideal for tight spaces, as well as a 5-axis X-Y-Z-Theta-R platform that allows for small component placement and exact alignment. It is capable of delivering large, per-component displacement outputs of up to 300µm along three axes and a rotation speed of up to 2000rpm. The flexibility of the bonder is further enhanced by the quick changeover and reconfiguration of spindles and stations. Gemini has an intuitive minifact-based software which enables quick and easy program creation, monitoring, and analysis. As part of its advanced processing capability, EVG / EV GROUP Gemini is capable of performing die pick-up, fine/coarse positioning, underfill dispense, reflow, and lid closing. The device also features a comprehensive set of user-friendly, customizable features that allow for intelligent fine-tuning, including substrate de-panelization and component handling. The extremely accurate bonder is compliant with RoHS, and the component-level security features help protect against data loss, as well as protect against tampering or infiltrations. Additionally, EVG Gemini is fully upgradable, as the latest software and firmware versions can be uploaded easily. Overall, EV GROUP Gemini is an advanced, automated die bonder that offers unbeatable performance and a wide range of features tailored to provide the most comprehensive bonding solutions. It is easy to use, requires minimal operator training, and its advanced security features provide optimal protection for the devices. As a versatile and powerful bonding solution, Gemini is the ideal choice for precision die-bonding applications.
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