Used EVG / EV GROUP Gemini #293637644 for sale

EVG / EV GROUP Gemini a bonder is an advanced semiconductor equipment platform that produces high quality, high yields of finished products. The bonder is designed for the highest level of performance and advanced process control. EVG Gemini has been developed to offer improved process control and bonding stability over other equipment. As a result, EV GROUP Gemini is the ideal choice for high-end process needs. Gemini bonder has a wide range of options available, including automatic transport, vision options, and an adjustable handling stage. All of these features help to optimize the process and improve yields. The auto transport option allows for the greatest throughput, while the vision equipment ensures accurate placement of the chips. Additionally, the adjustable handling stage ensures the highest quality alignment and bonding of the chips. The bonder is equipped with an advanced software system to control the process. This provides software control for the bond rate and temperature, as well as for the position and sequence validation. It also enables real-time monitoring of the parameters of the machine and process. The control unit can be integrated into a centralized management machine to provide even more control and visibility. The bonder also includes a powerful substrate rotation tool, allowing for complete control of the chip. The substrate rotation asset guarantees repeatability and accuracy, which is necessary for producing high quality bonds. The process can be fine-tuned for optimal results for each process cycle. EVG / EV GROUP Gemini bonder is designed for the highest throughput and most efficient processing. It is designed to handle large chip sizes in a very small footprint. The bonder also ensures fast and reliable throughput by providing consistent processing of the highest quality. The bonder is designed to be easy to operate and maintain. Its advanced features are both easy to use and provide advanced process control. It is designed with a modular architecture to ensure quick and easy maintenance and service. Additionally, upgrades and changes to the process can be done quickly and easily. EVG Gemini is an advanced bonder for high-end process needs. It offers improved process control and bonding stability, as well as a wide range of options including automatic transport, vision model, adjustable handling stage, and powerful substrate rotation. Its modular design allows for quick and easy maintenance and service, while its advanced features provide consistent processing of the highest quality.