Used EVG / EV GROUP Gemini #9229293 for sale
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ID: 9229293
Wafer Size: 8"
Vintage: 2013
Automated wafer bonding system, 8"
Substrate handling module:
Between alignment stage and load cassette
Loading / Unloading: 4-Axis industrial robot
With external optical prealigner
Wafer handling:
End effector for robot unit
With vacuum from bottom side
Bond chuck handling module:
Between alignment station and bond chamber
Automated operation of up to (4) bond modules
Unclamp station with handshake to linear transfer station
Cassette station:
Present sensor
Empty sensor
Graphical user interface for manual and fully automated operation
Independent sequence
Monitoring
Data storage
Wafer ID reader:
SEMI T1 (Barcode)
SEMI M12, SEMI M13 (Both alphanumeric)
SEMI T7 (Data matrix code)
High resolution alignment stage with DC servomotors in X, Y and Θ
Top and bottom wafer chuck with position measurement system
Fully motorized split field microscope for double side viewing
High resolution digital CCD cameras
Integrated magnification unit: 1x - 3x
Alignment with split field microscope
Objective: 5x
Loading chuck, 4"-6"
Bond module:
Universal bond chamber with top and bottom side heaters
Flag pulling mechanism
Up to 550°C and 3.5 kN
Atmospheric capabilities down to 1 x 10^-3 mbar (7.5 x 10^-4 Torr)
Pressure: 3 bar abs.
Connections for evacuation, purge and vent
Independent temperature controllers for top and bottom side of each chamber
Electronic pressure regulator for controlled contact force
Pneumatic wafer bow pin:
For most accurate alignment of separated wafers
Spring-loaded pin in bond chamber
Rapid cooling for top and bottom side heater:
For symmetric top / Bottom side cooling at identical
Forced water cooling
Silent operation
Programmable cooling rate
Increased piston force: Up to 10 kN (2250 lbf)
Resolution: 3 N steps
Pressure disk, 4"-6"
Universal bond chuck, 4"-6"
For anodic, thermo compresion and eutetic bonding process
Bond chuck with mechanical wafer direct clamping
Bond chuck out of titanium
Vacuum equipment with bypass system:
Pump time: < 2min from 1000 to 1 x 10^-3 mbar
Gas backfill time: < 10sec from high vacuum to 1 bar
Purge connections for process gas
Pump down time: From ambient to 2 mbar abs. pressure < 60s
Vacuum controller: 1 - 1000 mbar
Resolution: 1 mbar
Accuracy +/-0, 5% / +/-3 mbar
With piezo gauge and control valve
Minimum controllable pressure: 1mbar abs
Hardware:
SEMI-E4:
Semi Equipment Communication Standard (SECS-1)
Message transfer: Hardware interface RS232
SEMI E37:
High speed Secs Message Service (HSMS)
Generic services
Hardware interface: Ethernet TCP/IP
Tooling with system:
Bond chucks with graphite: 9 x 6”
Graphite pressure disks: 4 x 6”
Objective:
Bottom and top alignment
With standard 5x objectives with red LED
Second N2 line is installed in each module
Controlled with needle and bypass valves
Includes:
Chiller
(4) Vacuum pumps
(4) Turbo pumps are installed in chambers
Operating system: MS-Windows
2013 vintage.
EVG / EV GROUP Gemini Bonder is a production-ready, high-throughput, automated wafer bonding tool with precise and repeatable bonding results. This tool provides a robust platform for adhesive bonding thin wafers, and wafer-level packaging for sub-millimeter tolerances. EVG Gemini Bonder is designed to bring maximum throughput, precision and repeatability to the wafer bonding process. Its advanced features include control over temperature, pressure, and time. This ensures a robust bond that is durable and reliable. Additionally, EV GROUP Gemini Bonder features intuitive user interface, automation, and repeatable processes, with adjustable parameters to ensure the highest yield. With a small footprint and a low vacuum head, Gemini Bonder is an ideal solution for both small and large production processes. The system includes an auto load/unload module for wafers up to 8" diameter. The load/unload module includes precision nozzles to accurately and repeatably deliver bond fluids. It also has a four-head bonding station, which can accommodate up to four different bonding processes. The station is fully compatible with UV adhesive and gel systems. It also includes automated alignment, along with programmable pressure and temperature ramps. EVG / EV GROUP Gemini Bonder also offers total process control and real-time feedback, with the ability to save and load previously run processes for repeatability. It utilizes online menus to select, monitor, and control all of the process functions. EVG Gemini Bonder also features an easy-to-use GUI (graphical user interface) that allows users to monitor, tune, and adjust process parameters in real-time. EV GROUP Gemini Bonder is compatible with various packages and substrate materials, and it is highly configurable with a wide range of adjustable parameters. It is easy to integrate with other systems, and it is low noise, which makes it suitable for various cleanroom environments. Additionally, the system is compatible with a selection of optional hardware modules, which allow for further downstream application you. Examples include laser cutting, lithography, vision-based gating, and more. This makes Gemini Bonder an attractive choice for many wafer bonding applications.
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