Used EVG / EV GROUP Gemini #9229815 for sale

EVG / EV GROUP Gemini
Manufacturer
EVG / EV GROUP
Model
Gemini
ID: 9229815
Wafer Size: 8"
Bonder, 8".
EVG / EV GROUP Gemini is a high-precision thermosonic bonding tool, suitable for a wide range of industries. It provides quality results, especially in demanding applications such as optoelectronics, medical device assembly and semiconductor packaging. The machine can bond together both manual, as well as automatic processes. The built-in cameras monitor the bond process with great accuracy, while a digital camera allows for real-time viewing of the bond. The integrated optical system also allows the user to analyze the bond process in detail. The machine is equipped with a variety of specially designed tools which can be used for a wide range of tasks, such as thick-film patterning, chip-related processes and wire bonding. EVG Gemini has a number of features that allow for fast operation and improved performance. It features a thermogun designed for precise placement and isolation of the wires. A 300µm standard wire is also available for wire-bonding and precision bond formation. The machine is controlled by an advanced microcontroller with support for I/Os, as well as pulse and speed control. This allows for easy operation and higher process accuracy. In addition, the machine is also designed for ease-of-maintenance. All components are accessible and replacement parts can be quickly replaced. EV GROUP Gemini is a versatile and powerful tool that can be used for a number of tasks such as wire bonding, wire forming, die attach and others. With its advanced features, it is ideal for use in high-performance industries.
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