Used EVG / EV GROUP Gemini #9262790 for sale

EVG / EV GROUP Gemini is a high-tech bonding instrument that utilizes an advanced nanosurface alignment technology for advanced compound/structure/material connection applications. The machine operates with dual work zones, and features a heated XY-table with 350nm µm accuracy. It also features a superior tension and temperature control systems to ensure precise and repeatable bonding processes. The device also incorporates a state-of-the-art vacuum system, which provides a non-toxic, defect-free assembly for production, with up to 200mm wafer size handling capabilities. The device is equipped with an automatic wafer-level adjustment, a die-level adjustment, and integrated heat-seal chuck for precise sealing and placement. EVG Gemini offers precise and repeatable control of the temperature and pressure during bonding processes, with fast pressure control and precise temperature control up to 1000°C. It also offers precise and repeatable adjustment of the die and wafer levels, as well as broadcast wafer alignment and uniform wafer level adjustment. EV GROUP Gemini also offers excellent adhesion to a range of contact materials including metals, ceramics, and plastics, with up to 4-point fast contact feature. An integrated process monitoring system enables the user to acquire accurate Image feedback of the contact process. The device is further equipped with an integrated microscopy system, where a high-resolution CCD camera takes a live image of the structure/compound surface, enabling instant feedback on the contact process. Gemini is designed to bond a wide range of substrates, compatible with Hot Gas Reflow, Inductively Coupled Plasma (ICP), Plasmaless, and other advanced processes. The machine is suitable for micro-assemblies and structures, and provides a secure bond with reliable reproducibility.