Used EVG / EV GROUP Gemini #9298998 for sale

EVG / EV GROUP Gemini is a wafer bonding equipment designed for the most advanced industrial applications. Part of EVG automated bonder series, EVG Gemini utilizes an innovative five-axis motion system for precision, speed and flexibility that enable customers to achieve maximum throughput and yield for their low, medium and high-volume production challenges. EV GROUP Gemini bonding unit features a three-point, five-axes motion control machine that enables symmetrical or asymmetrical bonding between two substrates. Its high-precision, air-bearing spindles ensure smooth and accurate movement with +/- 5-micron tolerance. The dual spindles provide the flexibility for multiple face-down bonding options, enabling devices such as optoelectronics, multi-chip assemblies and OLED lighting to be bonded with high throughput, high uniformity and controllable reliability. To ensure the highest quality possible, Gemini features a precision vision tool to control the alignment of two substrates with +/- 5-micron precision and a high-speed laser pinpoint asset with +/- 5-micron accuracy. The optional True Position Technology allows for precise adjustable pre-alignment, pre-heating and post-cooling of devices, making EVG / EV GROUP Gemini the ideal solution for the most challenging assembly issues. In addition, EVG Gemini offers a variety of advanced process evaluation tools, including in-process microscopy, a focus tool to locate precisely bonded areas, a web-enabled user interface for intuitive operation, and an extended set of process development features. These tools provide a rapid development cycle and increased process control, resulting in higher yields and reduced risks. For easy integration, EV GROUP Gemini is supported by a broad range of third-party tools, such as design of experiments, real-time automated process optimization, quality optimization, and cell monitoring. Gemini also boasts compatibility with a variety of bonding techniques and materials, including epoxy, foil, and eutectic (solder) bonding for greater flexibility in product design. Overall, EVG / EV GROUP Gemini bonder is the perfect choice for a wide range of applications and customer needs. Its five-axis motion control model, high-precision vision equipment and advanced process evaluation tools allow for highly accurate, high-throughput bond production and yield optimization.