Used EVG / EV GROUP Gemini #9298999 for sale

EVG / EV GROUP Gemini is a state-of-the-art, high speed, semi-automatic die and wafer bonder specifically designed for the Microelectronics and Photonics industries. It is a modular tool capable of batch-able individual bonding processes. This versatile machine offers a large variety of configurations, allowing it to perform a broad spectrum of processes, including advanced flip chip bonding, three-dimensional (3D) stacking, microball bumping, and wafer bumping. EVG Gemini bonder utilizes an exceptionally fast auxiliary station for highly efficient loading and unloading of tool parts and wafers, ensuring reduced cycle times and maximum throughput. An integrated substrate/wafer holder is available for large substrates and wafers. The modular design of the tool allows for configurable setups for specific tasks such as z-axis force control, x-y stepping, and test pattern generation (TPG). The sophisticated technology-driven design of EV GROUP Gemini enables precise placement, alignment and precise control of bonding parameters. The equipment features advanced optics, including a high-resolution color camera for high-speed die placement and alignment as well as thermal imaging capabilities. It is also capable of processing wafers and substrates of various sizes with either direct thermode or laser heating. The powerful machine vision software is used to ensure consistent quality with image recognition enabled capability. In addition, the bonder features the industry's first embedded force control system: the Multi-zone Force-Controlled Bonder (MZFC). This system provides users with an improved level of accuracy in placing and aligning the dies or devices. It also provides user-defined zones to control the applied force to avoid and alleviate substrate or shingling related defects. The optional RF/ DC components, configurable metrology platform, and embedded touch-less handling of parts make Gemini one of the most advanced and efficient semi-automatic bonders available today. Its comprehensive features and capabilities enable it to meet the requirements for high-precision microelectronics and photonics applications and offer users a cost-effective and reliable die and wafer bonding solution.