Used EVG / EV GROUP Gemini #9390778 for sale

EVG / EV GROUP Gemini is a revolutionary automated bonder which enables fast and accurate bonding of 3D structures, optoelectronics, and many other applications. This equipment offers precision bonding down to 0.3µm with up to 99.999% yield. EVG Gemini is a multi-axis system designed for automated wafer and die bonding, with a very precise and controllable motion capability. Its multi-axis configuration allows for larger bond window, improved overlay, and extended layer-to-layer bonding. With EV GROUP Gemini unit, users can bond various substrates, including wafers, die, flex, prism, and even hard substrates and many more materials. Gemini's integrated bonding and metrology capabilities provide a total solution from setup to finish. Its integrated laser interferometer ensures precise alignment, with repeatable accuracy of better than 1µm across a large bonding window. Also included are tracking, focus & RGB imaging, plus right/left, up/down, and forward/backward motion control, allowing for precise control of bonding parameters. EVG / EV GROUP Gemini machine comes with a range of pre-configured process recipes and can be adapted for many applications, such as flip chip, wafer-level packaging, power electronics, and more. It also comes with an advanced Software Development Toolkit (SDT) which allows for customized recipe development and integration into automated production workflows. The tool is capable of providing high-accuracy and fast throughput to a wide variety of businesses, from small startups and individual research projects, to larger corporations and established manufacturers. With its high-quality, precise bonding capabilities, EVG Gemini is sure to provide reliable results for any business, big or small.