Used F&K DELVOTEC 5430 #9307519 for sale

F&K DELVOTEC 5430 is a high-precision bonder designed for precise fine pitch joining operations in the semiconductor and electronics industries. This bonder is specifically used for the joining of single and multi-filed semiconductor chips, as well as thicker substrates. It is a dual-axis linear bonder that uses a die-attach metrology equipment to ensure accuracy. The system is equipped with a high precision (3.5µm accuracy) pressure unit to ensure reliable results. 5430 bonder has a flexible and expandable design with a variety of different tools and options allowing it to be configured to meet the needs of many different applications. It has an intuitive user interface with a 16" color touchscreen, allowing for easy programming and operation of the bonder. It has a standard resolution of 2.5µm and a maximum pressure of 0.01-500N. The bonder is equipped an electro-optical vision machine, utilizing a high brightness LED light source and dual cameras for greater accuracy and repeatability when bonding small components. F&K DELVOTEC 5430 bonder has been designed with safety and reliability in mind and features a safety interlock and emergency stop capability for accidental shutdowns. It has also been tested and certified to meet the CE safety regulations, making it safe to operate and ensuring a long service life. The bonder is also UL approved and comes with a 3-year warranty. 5430 bonder is equipped with a PC-based controller and software, providing real-time changes and enhancements to the process parameters. It also features a comprehensive reporting tool that can be used to monitor and analyze the process. The bonder is capable of producing high quality bonds in a wide range of thicknesses, making it perfect for demanding Chip-on-Board (COB) and Flip-Chip applications. F&K DELVOTEC 5430 bonder is an ideal choice for the production of high-precision microelectronic assemblies and components.