Used F&K DELVOTEC 5600C #9376051 for sale

F&K DELVOTEC 5600C bonder is a state-of-the-art equipment designed for precision bonding of components in electronic device manufacturing and assembly processes. It features a pneumatically-controlled clamp-type bonding equipment with a camera-based identification system for application of adhesive to specific areas of the board or component. With its pneumatic clamp head clamp, 5600C offers superior bonding accuracy for precision-bonding applications. F&K DELVOTEC 5600C bonder has a vision-guided unit that automatically identifies and dispenses the correct type of adhesive to the exact area of the board or component to be bonded, ensuring strong and consistent bonds. The bonder is equipped with an integrated temperature-controlled needle-shaped applicator with step control and multiple feed options, as well as an optional optical inspection machine for monitoring adhesive application and bond verification. Additionally, it features a height-adjustable work stage and robust mechanical design for accurate positioning of the components during the bonding process. 5600C bonder is capable of bonding components with a wide range of materials, including solders, silicones, UV curing resins, and foam tapes, and is suitable for a wide variety of complex bonding applications. It also features a modular, expandable design that allows for easy and rapid integration into a variety of assembling processes. For maximum efficiency and reliability, F&K DELVOTEC 5600C bonder is designed for maintenance-free operation. The user-friendly tool features a temperature control asset and a self-diagnostic model for automatic monitoring of equipment performance. The bonder is also equipped with deep cycle batteries, automatically rechargeable, and is able to trap misapplied adhesive for easy removal and re-application. Overall, 5600C bonder is an advanced and reliable equipment for precision bonding of components in electronic device manufacturing and assembly processes, capable of bonding components with a wide range of materials. Designed for maintenance-free operation, this bonder is suitable for a variety of complex bonding applications and is easy and rapid to integrate into a variety of assembling processes.