Used F&K DELVOTEC 5632 DA #293637901 for sale

F&K DELVOTEC 5632 DA (daisy chain) is an advanced precision thermocompression bonder designed for packaging production of highly-dense powered devices. It offers high-precision temperature monitoring, precise placement over distances of up to 8 cm, and high-speed bond production. 5632 DA has a heated head capable of heating temperatures of up to 200 C. This allows it to apply accurate bonding forces to components with high process reliability. It is also equipped with advanced microprocessor controls, which offer individual temperature control and heating cycle programming capabilities. The bonder features a highly-accurate, four-axis motorized XY stage with end-effectors. This allows for precise alignment with target points and quick, easy positioning of parts for bonding. The end-effectors feature an easy access screw-adjustable contact element for controlled application of adhesive or solder to the bond interface. The bonder is also capable of producing high-precision splice connections. This is made possible by the multiple-axis bonding tip, which features an adjustable height profile that is capable of producing sub-micron splice connections. Additionally, the bonder includes a built-in bonding tip cleaning cycle to remove excess solder or adhesive from the bond interface. F&K DELVOTEC 5632 DA is a highly efficient bonding solution that can be used for a variety of applications, including lead-free connections and package assembly. With its advanced thermocompression bonding technology, it can reliably create reliable and durable bond connections. Additionally, its PIN grid array bondhead and powerful drive motors offer a high-speed, reliable solution for producing high-density packages. Its advanced features, including four-axis motorized XY stage and adjustable height profile, make 5632 DA bonder an ideal choice for high-speed, high-precision thermocompression bonding.