Used F&K DELVOTEC 6119 #159119 for sale

Manufacturer
F&K DELVOTEC
Model
6119
ID: 159119
Vintage: 1999
Semiautomatic gold ball bonder system Gold stub bumping also possible Machine is used primarily for wiring dies to packages Only limited amount of package holders available Maximum sample size is 100mmx100mm and maximum height is ~1cm Bonding takes place typically at 180-200°C Specifications: 25 um gold wire Substrate size: 100 mm x 100 mm maximum movement of the bonding tool Maximum height: ~1cm Temperature: 180-200°C Substrates: Practically all substrates allowed (Silicon, GaAs, InP, Glasses) Forbidden Materials: Highly toxic materials 6 A, 220 V Includes: Ultrasonic power supply Microscope with digital camera (2) hotplates 1999 vintage.
F&K DELVOTEC 6119 is a state-of-the-art wire and die bonder designed for high-volume manufacturing. It is ideal for use in a wide range of industries such as aerospace, electronics, automotive, and medical device manufacturing. 6119 is a fully automatic tool that is capable of handling a variety of tasks including ball, wedge, and stitch bonding. It features a wide range of interchangeable tools and cages which are easily interchangeable within the tool, allowing great flexibility in operation. The tool is designed to handle a wide range of wire dimensions, ranging from 0.003 to 0.75 mm in diameter. F&K DELVOTEC 6119 features a high-resolution camera that provides precise placement accuracy. It has a repeatability of 5 microns, and its precision placement is further enhanced by its ability to reduce scuffing and wire breaks. 6119 also features high speed, with bond rates of up to 150 bonds per second. This allows for increased productivity and outstanding throughputs. F&K DELVOTEC 6119 also features an advanced motion control system which allows for self-correction and counteraction. This means that it can react to sudden changes in pressure or other external forces, enabling it to maintain its position without the need for human intervention. 6119 is also equipped with a wide range of safety features for enhanced operator protection, such as a secure enclosure which prevents contact with the bonder and its components. It also features protection against ESD and radiation, power surge protection and integrated maintenance and diagnostic systems. F&K DELVOTEC 6119 offers superior performance and reliability, allowing it to easily handle the harsh conditions of a production environment. Its efficient design makes it easy to set up and maintain, with user-friendly interfaces and a robust operating system. With its flexible and reliable design it is an ideal choice for any assembly process, and with its competitive pricing, it provides great value for money.
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