Used F&K DELVOTEC 6200 #293621513 for sale
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ID: 293621513
Vintage: 2007
Ball/Wedge bonder
Rigid heating plates with width 170 mm
Heated oven/plates
Microscope
2007 vintage.
F&K DELVOTEC 6200 bonder is a powerful, cost-effective bonding and thermocompression system ideal for assembling micro-sized components encountered in advanced electronics operations. The system is designed to bond and thermocompress extremely small components with extreme precision, providing the user with greater flexibility and control than was previously possible. Capable of handling all types of bonding materials, from lead, to gold, and from indium to alloys, this machine is equipped with extremely accurate pressure, temperature and time control, providing superior control during bonding operations. The system is designed with a robust structure, ensuring optimal stability and reliability. With a sophisticated base of controllers, the machine is able to perform simultaneous multiple operations, with the ability to balance and adjust all parameters of the process. The high-definition display allows the user to view the entire bonding process and make adjustments as needed. The machine is highly reliable and dependable, due to its advanced technology, solid mechanical design and impressive software components. It is also user-friendly, with a convenient user interface that allows the machine to be programmed easily, with many programming features available to customize the bonding process to the individual component demands. In addition to the robust mechanical design, 6200 also features superior ergonomics, allowing easy access to all its control points, ensuring easy operation and ultimate accuracy. Furthermore, it has a small footprint, so that it can be easily incorporated into any type of production environment. F&K DELVOTEC 6200 is a powerful and resilient bonder suitable for high-precision bonding and thermocompression applications. With its advanced technology, mechanical precision and user-friendly design, this machine is an excellent choice for any high-volume bonding and thermocompression task.
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