Used F&K DELVOTEC 6200 #293760943 for sale

F&K DELVOTEC 6200 is an advanced bonding equipment for interconnect applications. It is a fully-featured deposition system used for a variety of processes, from electron beam evaporation (EBE), sputter deposition, chemical beam deposition, physical vapor deposition (PVD) and eutectic bonding techniques. This multi-process unit provides a range of features, including: Quick and easy operation through automated recipe-driven software and intuitive graphical user interface. Adjustable process parameters including film thickness, rate of deposition, heating and recipe settings. Controlled deposition speed and pre-heat functions Exact control of deposition speed and temperature to maintain film quality and uniformity Varied plasma etch option with process settings and software customization Integrated sensors Configurable machine design to fit customer specific process/application requirements. 6200 offers powerful and simple process recipes which save time and improve reproducibility of the process results. The 2D Path development tool enables the user to customize, develop and store the deposition process recipes. The tool can be configured with various source, process gas, chamber and exhaust interface options, to suit the customer's application. The high level of vacuum control provided by the stainless steel chamber and the integrated closed loop water cooling asset drastically reduces process errors, enabling reliable film quality. The high power planar magnetron sputter can handle a variety of materials that enables the coating of complex structures in a single process. The independent heat controllers in the EBE and sputter sources offer improved deposition uniformity and piece to piece repeatability. F&K DELVOTEC 6200 also features a variety of integrated process scanners, including eddy current, ultrasonic and internal/external film thickness measurement probes. These automated sensors give the user automatic process feedback, facilitating easier error diagnosis and correction. The model is designed to maximize throughput, with ultrafast loading/unloading, and can easily be integrated with automated material handling systems. The advanced automation functionality, process control and feedback, quality control options and integrated safety functions makes 6200 one of the best bonders in the market. It is suitable for a variety of applications and offers improved throughput, uniformity, repeatability and quality. By combining high deposition rate and process flexibility, it enables high deposition rates, with superior surface finish and substrate adhesion.