Used F&K DELVOTEC 6220 #9017901 for sale
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ID: 9017901
Vintage: 2000
Ball bonder
Bond Process Control (BPC) missing
2000 vintage.
F&K DELVOTEC 6220 Bonding Equipment is a high quality, market-leading bonder that is designed to provide efficient and precise applications for a wide range of industries and applications. The bonder is capable of high speed bonding, making it a great choice for production and assembly. 6220 bonder offers numerous competitive advantages, including superior temperature stability, extremely precise bonding parameters, and superior speed. These features provide the ultimate in quality and performance when it comes to the production of microelectronic components. F&K DELVOTEC 6220 has a high speed pulse laser which is capable of achieving 200+ mils per second, providing ultimate bond consistency and accuracy with even the most challenging of parts. The bonder is operated through the use of a handheld controller unit and has a range of user friendly features which make it easy to use and control. The control system provides the user with the ability to adjust the power, timing, and temperature, allowing for the operator to easily customize the bonder to suit the specific needs of their application. The bonder is a fully automated unit, meaning it requires minimal interventions once set up, allowing for a greater level of accuracy and reliability. It also has a one-year warranty, giving customers total confidence in their purchase. 6220 also offers a range of accessories and spare parts, making it easy for customers to customize their bonder to fit their exact needs. In addition to the features mentioned above F&K DELVOTEC 6220 has numerous additional benefits such as its hardened stainless steel and aluminium construction making it highly durable. The machine also has a range of security features, making it tamper and theft proof. This makes the bonder suitable for a range of applications, including industrial and military applications. Overall, 6220 Bonding Tool is reliable, high quality bonder that is suitable for a range of applications. It offers precise and efficient bonding with minimal input and setup required, and provides the ultimate in accuracy and reliability.
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