Used F&K DELVOTEC 6319 #9353538 for sale

F&K DELVOTEC 6319 is an advanced production industrial bonder designed for the demanding requirements of the modern electronics manufacturing environment. The bonder allows for high bond strength, precision and accuracy, and rapid bond times. It is designed for the production of complex, high-density electronic assemblies. The DELVOTEC 6319 has an intuitive, easy-to- use touchscreen interface for programming, programming and monitoring bonds. The integrated pressure sensors monitor the bonding force and feed back into the equipment to ensure that the proper pressure is applied each bond. The bonder allows for up to 23 programmable settings allowing greater flexibility and control when bonding various substrates. It is equipped with an ultrasonic generator and a 50 kHz piezo transducer, allowing it to make strong and reliable bonds on various substrates including copper and aluminum. The DELVOTEC F&K DELVOTEC 6319 has a fast heating chamber with a maximum temperature of 600°C, allowing it to bond reliably even on large and heavy platings. In addition, its high-resolution IR imaging system allows for accurate registrations of the substrate and die for precise placement. Furthermore, its process control unit can monitor the entire process, ensuring constant and consistent bond quality. 6319 bonder is ideal for electronics manufacturing operations that require consistent, high-strength precision bonds. It is easy-to-use and highly programmable, making it suitable for a wide range of production applications. In addition, its fast heating chamber, pressure sensors, and IR imaging machine provide reliable and accurate bonding on large and heavy platings. The bonder is designed for the demanding requirements of the modern electronics manufacturing environment and is a reliable choice for precision bonding.