Used F&K DELVOTEC 6320 #154742 for sale

F&K DELVOTEC 6320 is an automated wire and ribbon bonder designed for use in production environments. It is a precision tool for connecting conductive elements to substrates with fine wires, ribbons, and other materials. The Delvotec 6320 has a number of features that make it ideal for highly efficient production. It has an adjustable travel speed, ball plunger cutter, and adjustable force mechanism, which allow the operator to tailor the bonding process to the application needs. Additionally, the bonder has an intuitive, graphical user interface that makes it easy to set up and use. The Delvotec F&K DELVOTEC 6320 has a number of advanced features that make it a reliable and efficient production tool, even with complex assemblies. The bonder has an automated bonding, inspection, and alignment system that ensures continuity and reliability during production. It is also equipped with a unique laser-assisted welding system and an auto-tune welding head that can be programmed for different applications. Additionally, the system is designed with a modern and sophisticated control hardware and software allowing for individual control of each bonding process. The Delvotec 6320 is also equipped with a number of safety devices to protect the operator and equipment, such as an inductive proximity sensor for zone detection and an emergency stop switch. Additionally, the machine operates in accordance to ISO 4960 standards and is certified with the CE approval mark. The Delvotec F&K DELVOTEC 6320 is highly versatile and, due to its adjustable force mechanism, can accommodate a variety of substrates, such as printed circuit boards, flex circuits, semiconductors, etc. Furthermore, the machine can be used with a variety of wire and ribbon sizes up to 8mm wide. It is suitable for small and medium runs, as well as high-volume production. The Delvotec 6320 is the perfect tool for reliable and cost-effective production of wire and ribbon bonds. It is designed for ease-of-use, reliability, and efficiency and has the capability to handle a variety of substrates and wire/ribbon sizes.