Used F&K DELVOTEC 6320 #9254194 for sale

F&K DELVOTEC 6320 is an advanced bonder specifically designed for high performance assembly and bonding of microelectronic components and assemblies. This product is a fully automated, computer-controlled precision tool that is capable of bonding thin, fragile wiring, direct-attach point-to-point wiring, ribbon cable assemblies, flexible circuit assemblies, and chip-scale components to a variety of substrates. The DELVOTEC 6320 enables precise placement and controlled heat transfer for optimal repeatable results. F&K DELVOTEC 6320 features an ultrasonic bonder head, precise feedback control loop system, stationary bonder design, and a high-speed automated asset for precise bonding. The provided ultrasonic bonder head is capable of achieving high-quality and repeatable microwelds and thermosonic connections. The included feedback control loop facilitates precise control to maintain optimal temperature and pressure settings for each bond cycle. The installed software packages allow for programmable control of the bonder, including real-time monitoring and feedback of actual process settings. The advanced station design of the DELVOTEC 6320 provides complete flexibility to accommodate any assembly profile. Its adjustable stations can be customized to suit specific applications. The bonder's ergonomic design is intended to ensure operator comfort and accuracy in the placement of components and assemblies. The machine is also equipped with an easy-to-use touch-screen interface for easy programming, operation, and diagnostics. The asset is capable of providing high bonding efficiency while operating at speeds of up to 40 cycles/minute. This enables increased production throughput while maintaining a high-quality bond. The real-time feedback settings also help to optimize efficiency and process consistency. There are multiple safety features included to ensure operator safety and provide an extra level of protection from contact and radiation hazards. In conclusion, F&K DELVOTEC 6320 is an advanced station that provides precise, consistent, and repeatable bonding for microelectronic components and assemblies. With its advanced features, ergonomic design and optimized programming features, this product offers high performance assembly with increased efficiency and safety.