Used F&K DELVOTEC 6400 #293640188 for sale

F&K DELVOTEC 6400 is a state-of-the-art wire and ribbon bonder designed to deliver high-precision, reliable results while maintaining ease of use. This precision bonder offers an ergonomic operator interface and easy accessibility that allows for quick process changes with minimal downtime and effort. 6400 utilizes an innovative design for chip-to-chip bonding, with the capability to bond multiple connected chips autonomously. This ensures uniformity and consistency with each chip, regardless of size and layout. F&K DELVOTEC 6400 is powered by advanced motion control technology to precisely place and bond wires and ribbons up to 0.1mm wide. With a resolution of ±3µm, this bonder's accuracy and repeatability helps ensure high-yield and reliable results. 6400 is Thermal Pre-Bonding Compatible (TPC), which helps improve chip-to-chip adhesion prior to wire bonding and increases the success rate of chip-on-chip bonding. The equipment can also work with a wide range of materials, including gold, aluminum, silver, copper and pure copper. F&K DELVOTEC 6400 also features a high-resolution, 15.6-inch touchscreen panel that allows for easy adjustment and monitoring of all aspects of the machine's parameters. It also features lights focused on the bonding area, which provide illumination for a clear view of the wire bond process. This allows for the removal of the shadowing effect found in other systems and makes it easier to adjust the voltage, loop height and tension settings during wire bonding. For maximum efficiency, 6400 incorporates a dual-lane modular system that allows two jobs to run concurrently. Additionally, this unit is equipped with optional vacuum pick up and component handling outfitted with an external vision machine which enables flexible component Identification and handling. Combined, these features provide maximum flexibility while allowing users to easily adapt to future process and component changes. F&K DELVOTEC 6400 has been designed to optimize process yields, improve Operator efficiency and reduce overall tool cost of ownership. With its advanced motion control, vision-enabled component handling, high precision and repeatability, this wire bonder is the perfect tool for a wide range of applications such as consumer electronics, automotive and medical equipment.