Used F&K DELVOTEC 6400 #293795086 for sale

F&K DELVOTEC 6400 is an automatic wire bonding machine designed for combination with a field programmable gate array (FPGA). The machine uses advanced microprocessor-controlled wire bonding technology to connect electrical components to printed circuit boards (PCBs) and other substrates. The DELVOTEC 6400 is designed to provide precision and speed while bonding wires with a consistent force. The DELVOTEC F&K DELVOTEC 6400 features an integrated software platform that allows users to program, manage and monitor up to 256 bonding programs. This control equipment facilitates the efficient production of custom wire-bonding jobs and the adjustment of parameters for a variety of components and substrates. The machine is equipped with a 2-axis, pyramidal wire tension system and a powered tail-aggregate that ensures precise wire looping and tensioning. The bonding head is supported by an advanced micromanipulation unit, facilitating high-precision placement of wires at various angles and lengths. The machine's monitor calibration machine ensures accurate visual feedback for each wire, permitting repeatable accuracy of all parameters. The DELVOTEC 6400 is equipped with advanced diagnostic technology, allowing for the monitoring, printing and tracking of process data. By using a Windows-based PC, users can schedule programmable functions, such as automatic bonding speed regulation, wire tensioning and wire loop lengths, output data to a CSV file. The machine also features an intelligent motion control tool, providing an active feedback loop between the process parameters and the wire bond head, ensuring precision motion through integrated acceleration and deceleration ramp functions. The DELVOTEC F&K DELVOTEC 6400 is capable of bonding copper, aluminum and gold wires between 0.25 mm and 0.50 mm in diameter. The machine is compatible with a wide range of substrates, including (but not limited to) ceramic, organic, metallic and silicone. The DELVOTEC 6400 is capable of bonding bonding at speeds of up to 20,000 bonds per hour and has a maximum turret speed of up to 4800 rpm. Its advanced design is suitable for high-mix, high-volume production operations, as well as prototyping applications.