Used F&K DELVOTEC 6400 #9173403 for sale

F&K DELVOTEC 6400 is an advanced bonder designed for highly precise, uniform, and repeatable bonding. The device can be used for a number of different applications, including semiconductor packaging, fiber optics, and medical device manufacturing. The bonder's primary features include a high temperature bonder oven, a sophisticated bonding control equipment, and a unique four-axis motion control for precise and accurate placement of bond wires. To ensure the highest quality and repeatability, the bonder oven's temperature range can be set from 40°C to 212°C with an accuracy of ±0.01°C. Additionally, the oven features a sealed channel airflow system to reduce the impact of external temperature fluctuations on the desired bonding temperature. To further improve precision and accuracy, the bonding control unit utilizes a cascade-type PID process control to precisely regulate the required bonding parameters. Additionally, the machine is equipped with a measurement & control tool monitor, allowing for the real-time monitoring of thermal data for each stage of the bonding process. The four-axis motion control asset is designed to accurately and repeatably place small bond wires during multiple bonding applications. This model is made up of a head-mounted, high-precision linear guide along with a precision servo motor, and a precision rotary equipment. This combination of features ensures precise, repeatable placement of very small bond wires, at speeds of up to 30 ms, with positional accuracy of ± 0.0025 mm. 6400 is a premium, all-in-one solution for any of your automatic bonding needs. Its unique features and accuracy make it a reliable choice for high-grade bonding in a wide variety of applications.