Used F&K DELVOTEC 6400 #9191901 for sale

F&K DELVOTEC 6400 is a state-of-the-art wire bonder for automated wire bonding processes. It is a fully-integrated equipment designed forhigh-speed, precision bonding of all different types of metal, as well as other materials such as plastic and thermoplastic substrates. The system consists of a precision power supply, a dedicated controller that monitors unit parameters, and an advanced carrier platform. All components are housed within a compact, durable, and low-footprint manufacturing environment. 6400's power supply provides precise pulse and current control to ensure reliable and consistent bonding for the highest levels of process accuracy and repeatability. The power supply includes voltage settings for both gold and aluminum wire-bonding processes. F&K DELVOTEC 6400 also includes an automatic bonder head alignment machine which maintains accuracy across different substrate heights and locations, allowing for absolute repeatability across multiple product cycles. 6400's advanced carrier platform is designed to offer maximum flexibility and efficiency. With its diagonal motion path and integrated process automation, F&K DELVOTEC 6400 is capable of achieving high throughput rates of up to 5000 bonds per hour, making it suitable for high performance industrial applications such as automotive component assembly. 6400 accommodates up to 72 bonding blocks for maximum through put and reliability and allows for multiple bond pad sizes. F&K DELVOTEC 6400 also supports ball bonding, wedge bonding, and ribbon bonding processes. 6400 minimizes setup times with its high-speed jetting and auto-pick and place abilities. The tool is also equipped with an array of advanced diagnostic functions and features, such as particle and defect detection, wire bond length programming, failure analysis, and process log. These comprehensive functions enable operators to easily and quickly optimize process parameters and minimize rework and scrap. In addition, F&K DELVOTEC 6400 is capable of automating wire bonding on an entire panel or PCB in one pass, minimizing cycle times even further. The asset is designed to operate within a wide range of operating parameters, including temperature, humidity, and dust levels. Overall, 6400 is a dependable, high-speed wire bonder capable of meeting the strictest demands of industrial production. With its advanced power supply, precision carrier platform, and comprehensive diagnostic package, F&K DELVOTEC 6400 is an excellent choice for the high-speed, efficient bonding of various substrates.