Used F&K DELVOTEC 6400 #9199523 for sale

F&K DELVOTEC 6400 is an advanced, automated wire and wedge bonder. It is designed to handle both fine- and large-pitch wire-based connections, as well as a variety of wedge bonding applications such as ribbon bonds and ball bonding. 6400 has a number of features and capabilities that make it well suited for the rigours of manufacturing. Firstly, its intuitive software interface is highly accessible and easy to use; no prior experience is required to operate this powerful piece of machinery. The system can be easily configured to suit specific requirements, including wire layout and pitch, wire sizes and material, and looping patterns. In addition, F&K DELVOTEC 6400 also offers great speed and precision. Its programmable X, Y, Z table drives the needle tool for repeatable positioning, whilst its high-speed indexing ensures fast looping and reliable bonding. And thanks to its automated bond probe and test, 6400 can quickly and accurately detect faulty connections on the chip or substrate. Another desirable feature is F&K DELVOTEC 6400's dual wire feeding. This allows the machine to simultaneously conduct two wire bonding operations on the same substrate or die, thus allowing it to increase throughput. 6400 also features advanced safety features, such as a transparent protective shield to protect the operator, redundant safety interlocks to stop the machine's movements when the lid is open, and automatic shut-off when the process is completed. All in all, F&K DELVOTEC 6400 is a highly performant automatized wire and wedge bonder. With its intuitive software, speed and accuracy, dual wire feeding, and comprehensive safety features, it is an ideal choice for any manufacturer conducting chip or substrate bonding.