Used F&K DELVOTEC 6400 #9280937 for sale

F&K DELVOTEC 6400 bonder is a precision equipment designed for the bonding of a variety of materials including metals, ceramics, and plastics. The system is equipped with high-quality controllers and components for reliable, consistent bonding performance. It provides an ideal platform for a wide variety of fine pitch wire bonding applications in the electronics and semiconductor industries. 6400 utilizes a wide range of high-precision wire bonding techniques, including thermocompression, thermosonic, ultrasonic, and wedge wire bonding. The unit is capable of working with an extensive range of materials, including gold, aluminum, copper, and silver, as well as with a variety of different wire diameters. The bonder's advanced fin line feeder machine allows for fast wire-bonding with a high degree of accuracy. The tool is equipped with a closed-loop control asset, which provides real-time bond feedback and allows for seamless transitions between different bonding techniques. The model is also capable of simultaneous normal condition/excitation operations, enabling quick and seamless fine wire bondings. F&K DELVOTEC 6400 also offers a highly flexible design, enabling users to adjust the pitch and bond-angle settings for each wire and for each hybridization. This ensures that each bond is created with the maximum potential for strength and reliability. Moreover, the equipment is fully compatible with industry-standard software packages, such as F&K DELVOTEC Wakesizer software package, allowing easy integration and control. In addition, 6400 includes a number of reliable check, verification, and visual inspection systems to ensure maximum bond integrity. The system also includes shutters that provide a dust-free environment to keep components clean and safe. Furthermore, the optional CCD Inspection Unit provides non-contact inspection capabilities for fine and hybrid wire bonding. Overall, F&K DELVOTEC 6400 bonder is an excellent choice for fine pitch wire bonding applications in the electronics and semiconductor industries. Its advanced controllers and components provide superior quality wire bonding and reliable bond integrity, while its flexible design and sophisticated control systems make it easy to use.