Used F&K DELVOTEC 64000 G5 #293639960 for sale

F&K DELVOTEC 64000 G5 is an advanced wire and ribbon bonder designed for high-yield chip-on-board (COB) and die-attach processes in the electronics manufacturing industry. This bonder is designed to be reliable and efficient, providing users with flexibility, precision, and a high level of automation. The wire and ribbon bonding process is one of the most important steps in assembling an electronics circuit board, as it is responsible for connecting components together with the necessary electrical connections. 64000 G5 is a high-end bonder which is capable of handling a range of thicknesses, materials and bond types, providing flexibility to meet any customer's needs. This bonder is equipped with a 3-axis motion equipment, which is capable of achieving movements of up to 30 G's. This allows the machine to be positioned accurately and provides stable operation with minimal vibration at high speeds. The user can control the position of the bonder's head via the intuitive numerical control software that is integrated within the system. F&K DELVOTEC 64000 G5 utilizes a high-precision 5-axis vision control unit which ensures accurate alignment of bond pads and enables a higher level of accuracy than conventional wire bonding systems. This machine is capable of automatic detection of wires, position and length, allowing for minimal manual intervention. In addition to the advanced vision control tool, 64000 G5 is equipped with the reliable 'Pulsed-Laser Gold' bonding technique. This technology offers a high degree of repeatability and low levels of ambient interference. It is a sophisticated method of wire bonding and provides great stability for long periods of time. This bonder also offers excellent thermal stability, with a heating capability of up to 500°C. It features a fast response heating asset with a Peltier element and a thermocouple sensor which give accurate temperature readings and stable temperatures for a wide range of applications. F&K DELVOTEC 64000 G5 is designed to be easy to use and operate with minimal effort. The intuitive graphical user interface allows the user to quickly program and control the bonder, making it suitable for a wide range of applications. Overall, 64000 G5 is an advanced bonder which provides users with a high level of precision, speed, flexibility and automation as well as thermal stability. This makes it suitable for high-yield chip-on-board and die-attach processes in the electronics manufacturing industry.