Used F&K DELVOTEC 64000 G5 #9217518 for sale

F&K DELVOTEC 64000 G5 bonder is a high-performance, multi-process bonding equipment that enables integrated circuit (IC) assembly and micro-device manufacturing. The system is capable of forming strong, reliable thermocompression (TC), thermosonic (T/S) and ultrasonic (US) connections for a variety of substrates, including organic boards, metal cores, and substrates with different thicknesses. It offers a range of options for wafer-level packaging (WLP) and chip bonding from different high-performance chip/wafer combiners, such as Thermo Wedger and Pyro Wedger. The unit also offers soldering capability using the in-line Laser Soldering Unit (LSU) or the optional Laser Direct Soldering (LDS) or offline soldering option. The bonder is equipped with a patented Flux-Terminal feature, which enables simultaneous cleaning and vaporizing of the metallization between the pads to ensure fast and reliable joining. The bonder features a dual-position head block that can operate at a top speed of 1200 cycles per hour. The fast cycle times and high-precision metrology capabilities, along with a "cool-down" period that ensures precise process control, enable the process repeatability and uniform bond creation. The robust tabletop construction and an electricity isolation design, in addition to creating an environment for safety during operation, also ensures process reliability and stability. The sophisticated process and automation control is based on an intuitive user interface for fast and precise user interaction. The advanced connectivity and communication possibilities allow for easy integration of the machine into the manufacturing process. 64000 G5 bonder is ideal for low-volume to high-volume applications, as well as high-quality and fast deliverables.