Used F&K DELVOTEC 64000 G5 #9224791 for sale
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ID: 9224791
Vintage: 2009
Hybrid wedge bonder
Heated stage
Deep access:
Fine wire
Diameter: Ø 17 μm to 75 μm
Aluminium
Gold
Ribbon up to 250 μm x 50 μm
Speed: (2-3) wires per second
90° Wire / Ribbon feed
Wire spool, 2"
Single wire clamp cascadable with holding clamp for secure tear-off
Machine data:
Working area:
X: 254 mm
Y: 153 mm
Z: 40 mm
P-Range: 200° In each direction
Monitor: Flat screen, 19"
Microscope: Stereo zoom with adjustable work position / Light intensity
Compressed air: 5 Bar to 8 Bar
Vacuum: Minimum < 0.8 Bar
Positioning accuracy:
Repeatability: +/- 5 μm at 3 sigma
Ultrasonics:
Digital generator: 30 kHz to 250 kHz
Transducer: 40 kHz to 145 kHz
Wire de-spooler: Fully automatic
Machine control:
PCI
Operating system: UNIX
Pattern recognition:
Moving CCD camera: 0.1 Pixel resolution
COGNEX 8000 (Pat maximum, pat quick)
Lighting:
Type and intensity program controlled
Red LED
Traceability:
Optional standard export of up to 336 quality data per wire
Networking:
TCP / IP
Ethernet
SECS / GEM
Power requirements:
Minimum 0.6 kVA
Maximum 3.2 kVA
200 V-240 V / 100 V-120 V (-5%, +10%), 50 to 60 Hz, Single phase
2009 vintage.
F&K DELVOTEC 64000 G5 is a modern, automated wire and fine-pitch bonding machine specifically designed for the automation of advanced packages such as BGAs, lead frame QFNs (quad flat no-lead), package on package (PoP), small chip scale packages (CSPs), and MEMS. 64000 G5 is equipped with a Windows-based, graphical user interface for easy control and programming. The user can control all machine parameters such as temperature, pressure, movement, and sensor settings. The machine incorporates a high-performance servo-controlled, programmable wire distance control technology, which permits to manufacture fine pitches and high density applications that other machines may not be able to manage. It is capable of bonding wires with a diameter of 0.1mm up to 0.5mm. The equipment has numerous features that tailor to distinct needs such as its modular design that allows users to install additional tools to customize the bonder to suit specific requirements. As such, it can be mounted with a die attach head that includes Pressure Time Control, and Force Dispense Control. On top of this, F&K DELVOTEC 64000 G5 comes with a 7-axis robotic arm that handles movement and alignment of all components, as well as reliable stamped-pin preheating and thermode cooling functions for proper thermal cycling of the parts. The bonder offers high flexibility and accuracy, as well as fast response and program executions. Its advanced vision system is capable of 3D recognition, capable of recognizing features such as fiducials, ICs, and components. The machine can work in temperatures ranging from 18 to 35 degrees Celsius with no issues. Furthermore, 64000 G5 comes with a special module that allows user to connect to a network server or a printer for log recording, maintenance and remote access. Overall, F&K DELVOTEC 6000 G5 is an automated bonding machine designed to manage advanced packages and high-density applications with superior precision and flexibility. It is capable of handling wire bonding and fine-pitch bonding using a servo-controlled wire-distance control. It features a Windows-based user interface and various modules to tailor the machine to individual needs. It has a 7-axis robotic arm for accurate movements and alignment, as well as for preheating and thermode cooling functions. Furthermore, F&K DELVOTEC 64000 G5 comes with an advanced vision system that provides 3D recognition of components, as well as with a module that allows it to connect to a network server or a printer.
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