Used F&K DELVOTEC 6400DA #9164298 for sale

F&K DELVOTEC 6400DA Bonding Equipment is a modern and highly efficient automated bonding solution designed for automated high-precision die bonding of complex 3D structures. Utilizing the latest advances in automated die handling and the latest technology, 6400DA can meet the highest levels of accuracy and performance requirements for die bonds. F&K DELVOTEC 6400DA features a modular design to accommodate a variety of die size and thermal bonding requirements. The robust, ultra-precise motion system is designed to support both standard and advanced aluminum indium phosphide (AIP) and gold/copper plated die attach applications. It includes a 360-degree rotational table, 3D force to position control to maintain uniform bond conditions across each die attach, and integrated heat plate for additional thermal accuracy. Equipped with F&K's advanced optical alignment technology, 6400DA can accurately align the die to the bond pads without needing any additional calibration. This technology ensures less misplacement and reduces defects when bonding.Users can easily configure, control, and monitor F&K DELVOTEC 6400DA with the intuitive interface. It allows them to fine tune parameters for various die sizes and shapes under varying thermal conditions. 6400DA also includes advanced software functions such as statistical process control (SPC) and advanced trace analysis. With these functions, users can monitor and get more data regarding the process, and make informed decision and adjustments that can result in improved yield and productivity. F&K DELVOTEC 6400DA is built with safety in mind. Its state-of-the-art safety features help protect operators from unexpected hazards, such as hazardous equipment motion. 6400DA is also designed to minimize maintenance requirements for a seamless and efficient operation. In addition, the unit can be integrated easily into existing production environments. F&K DELVOTEC 6400DA Bonding Machine is the leading option for automated die attachment and bonding. Its advanced features and technology make it a must-have for any die bonder requiring a complex and high precision production solution.