Used F&K DELVOTEC 6830 Atlas II #9008843 for sale

F&K DELVOTEC 6830 Atlas II is a thermosonic wire-bonding equipment for semiconductor and electronics assembly applications. It combines unsurpassed accuracy and precision with innovative features in a high-performance platform. The Atlas II uses ultrasonic energy to provide accurate and repeatable bond formation. This is done through high frequency vibration of the ultrasonic transducer horns, which have the ability to generate a reach force level in excess of 500 grams. The DC motors are accurate, allowing for precise alignment of the ball and wedge bonder heads, as well as permitting repeatable bond placement. The user interface is based on the Windows operating system and is equipped with a 21" touchscreen display. The interface also features a library of automated routines which allow users to quickly and easily program operations. This makes it easier to perform repeatable bonding cycles, as well as the ability to quickly change parameters in order to optimize the bond quality. 6830 Atlas II is designed for use with various semiconductor devices including silicon, gallium arsenide, gold, aluminum, and silver. The unit has several features that make it suitable for a wide range of applications. These include an automated wire-cutting feature, automated wire-tensioning, a quick release tool changer, and a closed loop feedback machine. The device is also equipped with numerous safety features such as a bonder shield, double insulation, positive pressure nitrogen supply for ideal conditions, and a temperature sensor. The tool also includes a fault log, which can help to quickly identify and isolate errors. Overall, F&K DELVOTEC 6830 Atlas II is the perfect solution for efficient and reliable semiconductor and electronics assembly operations. Its precision and accuracy, combined with its extensive range of features and capabilities, make it an ideal choice for a variety of applications.